Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method

ABSTRACT

A top-side cooled semiconductor package with stacked interconnection plate is disclosed. The semiconductor package includes a circuit substrate with terminal leads, a semiconductor die atop the circuit substrate, a low thermal resistance intimate interconnection plate for bonding and interconnecting a top contact area of the semiconductor die with the circuit substrate, a low thermal resistance stacked interconnection plate atop the intimate interconnection plate for top-side cooling, a molding encapsulant for encapsulating the package except for exposing a top surface of the stacked interconnection plate to maintain effective top-side cooling. The top portion of the stacked interconnection plate can include a peripheral overhang above the intimate interconnection plate. The peripheral overhang allows for a maximized exposed top surface area for heat dissipation independent of otherwise areal constraints applicable to the intimate interconnection plate. The stacked interconnection plate can be partially etched or three dimensionally formed to create the peripheral overhang.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of a pending US patentapplication entitled “Top-side Cooled Semiconductor Package with StackedInterconnection Plates and Method” application Ser. No. 12/326,065,filing date: Dec. 1, 2008, inventor Kai Liu et al (attorney docket#APOM019). The above contents are incorporated herein by reference forany and all purposes.

FIELD OF INVENTION

This invention relates generally to the field of electronic systempackaging. More specifically, the present invention is directed to thephysical level packaging of semiconductor dies.

BACKGROUND OF THE INVENTION

Owing to their high integration density, extremely low quiescent leakagecurrent and ever improving power handling capacity, power MOSFETscontinue their popular adoption in power electronics such as switchingpower supplies and converters. Some of the highly important attributesof power MOSFETs are their continuously shrinking packaged size andaccompanying increased heat dissipation driven by the consumer market.

As a result, power semiconductor device packages with dual side cooling(top and bottom side) are required in many high-power densityapplications in order to minimize the device operating temperature thusmaximize the device and system reliability and efficiency. Bottom sidecooling has been achieved by mounting the semiconductor chips onmetallic leadframes or heat conductive substrates, or by incorporatingthermal vias if laminated circuit substrates are used. The followingbriefly reviews some prior arts for achieving top side cooling.

In a so-called “DirectFET” approach (U.S. Pat. No. 6,624,522, U.S. Pat.No. 7,285,866, US Patent Application Publication 2007/0284722), thesemiconductor die(s) are required to be mounted upside down inside ametal can such that the backside of die(s) which is typically the drainof a discrete power MOSFET is in electrical contact with a “lid” of thecan. The metal can acts like a drain connection to the back of the die,a “lid” as well as a “top side” heat sink for top side cooling. On theother hand, source and gate electrodes on the actual top side of the dieare facing down and connected to a circuit board which acts as a bottomheat sink surface. Thus, with the “DirectFET” approach, its externalgeometrical connections, or package footprint, are not configured toconform to an industry standard package pin out such as, for example,the SO-8 package footprint.

In U.S. Pat. No. 6,777,800 entitled “Semiconductor die package includingdrain clip”, A drain clip having a major surface is electrically coupledto the drain region of the semiconductor die. A non-conductive moldingmaterial encapsulates the die. The major surface of the drain clip isexposed through the non-conductive molding material for top sidecooling. However, this packaging approach requires a flip-chipconfiguration that complicates the die packaging process.

The following briefly reviews some prior arts using top side platebonding with plate exposure for achieving top side cooling whileachieving package footprints that conform to an industry standardpackage pin out.

U.S. application Ser. No. 11/799,467 disclosed a semiconductor packagehaving dimpled plate interconnections. FIG. 17 and FIG. 18 of U.S.application Ser. No. 11/799,467 are respectively reproduced here as FIG.1A and FIG. 1B and briefly described. Thus, with reference to FIG. 1Aand FIG. 1B, a source plate 1700 includes a plurality of dimples 1710formed thereon. The dimples 1710 are concave with respect to a topsurface 1715 of the source plate 1700 and include a through hole 1720having an opening 1725 formed beyond a plane of a bottom surface 1730thereof. Similarly, a gate plate 1750 includes a dimple 1760 that isconcave with respect to a top surface 1755 of the gate plate 1750 andincludes a through hole 1770. This package is compatible with industrystandard package pin outs, however this package does not achieve topside cooling.

In U.S. Pat. No. 6,249,041 entitled “IC chip package with directlyconnected leads” by Kasem et al, hereafter referred to as U.S. Pat. No.6,249,041, an improved semiconductor device is disclosed that includes asemiconductor chip with contact areas on the top or bottom surface. FIG.3B of U.S. Pat. No. 6,249,041 is reproduced here and labeled as FIG. 2and briefly described. A power MOSFET package 41 constructed is shown incross sectional view. The power MOSFET package 41 has a power MOSFETchip 42 powered by common contact areas. A source contact area and agate contact area on the top side of chip 42 are each covered with ametallization layer formed from a conductive metal. Likewise, a draincontact area on the bottom side of chip 42 is covered with ametallization layer. A source lead assembly has a contact area 48 a incontact with the source contact area on chip 42. Contact area 48 a onsource lead assembly is held in contact with source contact area on chip42 by an electrically conductive adhesive layer 49. Three source leads48 b extend from contact area 48 a to provide electrical contact with aprinted circuit board. Like source lead assembly, a gate lead assemblyalso has a contact area in contact with gate contact area on chip 42.Similarly, a drain lead assembly has a contact area 52 a in contact withthe drain contact area on the bottom side of chip 42 and four drainleads 52 b extending from contact area 52 a to provide electricalcontact with the printed circuit board. Contact area 52 a on drain leadassembly is held in contact with the drain contact area on chip 42 by anelectrically conductive adhesive layer 53. A plastic encapsulant 54encapsulates chip 42, contact areas 48 a and 52 a of lead assemblies,and portions of leads 48 b and 52 b of lead assemblies. Encapsulant 54provides electrical and thermal insulation of chip 42 from the outsideworld, as well as giving structural support and rigidity to the powerMOSFET package 41. However this package also does not achieve top sidecooling.

In U.S. Pat. No. 4,935,803 entitled “Self-centering electrode for powerdevices” by Kalfus et al, hereafter referred to as U.S. Pat. No.4,935,803, an improved means and method for forming leads to a powerdevice is disclosed by use of a one-piece leadframe on which the die ismounted and a separate connecting clip between the leadframe and thebonding pad on the semiconductor die. FIG. 4 of U.S. Pat. No. 4,935,803is reproduced here and labeled as FIG. 3. In cross-sectional view, die16 having contact region 22 surrounded by raised dielectric 18, ismounted on die flag 13 by attachment means 20. Attachment means 20 maybe conductive or insulating, but conductive solder is frequently usedwhen die support 12, 13 is also intended to serve as one of theelectrical leads of the device coupled to die 16. Lead 30 is providedextending toward die 16 and is intended to serve as an externalconnection to die 16. Conveniently located near the end of lead 30,closest to die 16 is alignment means 32, 52. In the example shown,alignment means 32 has the shape of a depression in lead 30 but othershapes such as a protrusion could also be used. In FIG. 3, alignmentmeans 32 has the shape of a substantially hemi-cylindrical groove orother rounded two dimensional shapes whose long dimension extendstransverse to the direction from lead 30 toward die 16. While alignmentmeans 32, 42 are shown as being convex downward, they could also beconvex upward, i.e., bumps or protrusions rather than depressions.Connection means or clip 40 extends from lead 30 to contact region 22 ondie 16. Connection means 40 is attached to lead 30 and die contact 22 bybonding material 36 and 38, respectively. Connection clip or means 40has alignment means 42 at a first end which mates with alignment means32 of lead 30 and, at a second end, has attachment means 46 havingbottom 48 which is coupled to die contact or bonding pad 22. The shapesof alignment means 42 are such that they engage alignment means 32. Thegroove shaped depressions of alignment means 32 and 42 permit connectionmeans 40 to move transverse to the direction extending from lead 30toward die contact 22 on die 16, but restrain movement of clip 40relative to lead 30 and die contact 22 in the direction toward diecontact 22 and restrain horizontal (azimuthal) rotation of connectionmeans 40 relative to lead 30 or bonding pad 22. However, connectionmeans 40 is able to rotate during assembly in the vertical plane. Thisis desirable since it permits substantial variations in the thickness ofdie 16 to be accommodated with no change in the leadframe or connectionmeans. This simplifies manufacturing. The configuration shown in FIG. 3is particularly useful for this purpose because the nested curvedsurfaces of alignment means 32, 42 form a rotary hinge which permitsvertical rotation of connection means 40 relative to lead 30 withoutsubstantial change in the spacing of alignment means 32, 42. In thisrespect it is also desirable that the end of connection means 40 whichattaches to bonding pad 22 also be curved, as illustrated by attachmentmeans 46. U.S. Pat. No. 4,935,803 also does not achieve top sidecooling.

In US Patent Application 20080087992 entitled “Semiconductor packagehaving a bridged plate interconnection” by Shi Lei et al, hereafterreferred to as US 20080087992, a semiconductor package with a bridgedsource plate interconnection is disclosed for packaging a semiconductordie. FIG. 7 and FIG. 5 of US 20080087992 are reproduced here andrespectively labeled as FIG. 4A and FIG. 4B. In FIG. 4A is illustrated asemiconductor package 700 includes a leadframe 705 having a die pad 107,a source contact portion 110 and a gate contact portion 115. A powersemiconductor die 120 may have a metalized drain area (not shown)coupled to the die pad 107 by solder reflow. A bridged source plate 130includes a metal plate stamped or punched to form a bridge portion 131,valley portions 133 on either side of the bridge portion 131, planeportions 135 on either side of the valley portions 133 and the bridgeportion 131, and a connection portion 137 depending from one of theplane portions 135. Bridged source plate 130 includes a pair of dimples710 formed in respective valley portions 133. The dimples 710 areconcave with respect to a top surface 720 of the valley portions 133 andhave bottom surfaces (not shown) extending beyond a plane of a bottomsurface thereof. A gate plate 750 electrically connects the gate contactportion 115 of the gate lead 117 to a gate metalized contact area (notshown) on the power semiconductor die 120. A gate plate dimple 760 ispositioned and stamped or punched on the gate plate 750 so as to alignwith the gate metalized contact of the semiconductor die 120 duringsolder reflow. The gate plate dimple 760 can optionally include athrough hole 770. FIG. 4B illustrates a preferred embodiment of US20080087992 that is a semiconductor package 500 including a top surface510 of the bridged source plate bridge portion 131 exposed through anencapsulant 520. The exposed top surface 510 provides for thermaldissipation of heat generated by the power semiconductor die 120. Inaddition, the exposed top surface 510 provides an attachment surface foran additional heat sink for additional heat dissipation. Flow ofencapsulant material under the bridge portion 131 provides for increasedmechanical strength of the package 500.

In a commonly assigned U.S. patent application Ser. No. 12/130,663 withfiling date May 30, 2008 and entitled “CONDUCTIVE CLIP FOR SEMICONDUCTORDEVICE PACKAGE” by Shi Lei et al, hereafter referred to as U.S.application Ser. No. 12/130,663, a semiconductor device package with aconductive clip having separate parallel conductive fingers electricallyconnected to each other by conductive bridges is disclosed. FIG. 2A andFIG. 2D of U.S. application Ser. No. 12/130,663 are reproduced here andrespectively labeled as FIG. 4C and FIG. 4D. FIG. 4C illustrates asemiconductor device package 200 with its gate bond wire replaced with agate clip 208. The device package 200 includes a fused lead frame 102, aMOS device 114 having top source, top gate and bottom drain located ontop of the lead frame 102 and a clip 112 having separate parallelconductive fingers 104 electrically connected to each other byconductive bridges 106. The clip 112 is electrically bonded to the topsource of the MOS device 114 only at the bridges 106. The fingers 104may exhibit a bend out of the plane of the clip 112 in order tovertically contact with the fused source lead 118. In this embodiment,the top gate is electrically connected to the gate lead 110 of the leadframe 102 by a gate clip 208. The top surface of the gate clip 208 andthe top surface of the clip 112 are coplanar in this example. FIG. 4D isa perspective view of the semiconductor device package 200 after coveredwith molding compound 216. As shown in FIG. 4D, the top surface of theclip 112 and the gate clip 208 are exposed.

In a commonly assigned U.S. patent application Ser. No. 12/237,953 withfiling date Sep. 24, 2008 and entitled “Top Exposed Clip with WindowArray” by Shi Lei et al, hereafter referred to as U.S. application Ser.No. 12/237,953, a semiconductor device package with single stage clipsis disclosed. Each single stage clip includes a metal sheet havingarrays of windows thereon. FIG. 1A and FIG. 1B of U.S. application Ser.No. 12/237,953 are reproduced here and respectively labeled as FIG. 4Eand FIG. 4F. As shown in FIG. 4E, the semiconductor device package 100includes a fused lead frame 102 and a semiconductor device 104 havingcontact regions on top and bottom surfaces. By way of example, thesemiconductor device 104 may be a vertical metal oxide semiconductor(MOS) device having a top source contact S, a top gate contact G and abottom drain contact D. In this example, the age 5 of 21 semiconductordevice 104 is located on top of the lead frame 102 with the bottom draincontact D facing and making electrical contact with the main portion ofthe lead frame 102. By way of example, the lead frame 102 may be fusedor non-fused. As an embodiment of U.S. application Ser. No. 12/237,953,the semiconductor device package 100 includes single stage clips 106,which include two separate metal sheets 108 and 110 having arrays ofwindows 111 and 113 respectively. Here, metal refers to a material thatis thermally and electrically conductive, and preferably is malleable.In metal sheet 108, arrays of conductive fingers, each of which includesa first end and a second end, are formed to make electrical contact withthe source contact region S of the semiconductor device 104 at thesecond end of the conductive finger. The first end of each of theconductive fingers is electrically connected to the metal sheet 108 ateach of the corresponding windows 111. This configuration provides formultiple electrically parallel paths that are separated from each other.One or more additional conductive fingers may be formed from a separatemetal sheet 110 to provide electrical contact between the gate contactregion G of the semiconductor device 104 and gate leads 107 of the leadframe 102. Each of the conductive fingers includes a first endelectrically connected to the metal sheet 110 at a window 113 and asecond end formed to make electrical contact with the gate contactregion G of the semiconductor device 104. Electrical and mechanicalcontact between the conductive fingers and contact regions S, G may beestablished, e.g., through the use of a solder or conductive adhesive.As shown in FIG. 4F, the semiconductor device package 100 may beencapsulated with molding compound 118 and leave the tops of the metalsheets 108, 110 exposed. The exposed area is large and allows forefficient heat dissipation. However, the contact area to thesemiconductor device 104 is small.

While the above cited prior arts using top side plate bonding technologywith plate exposure do offer numerous advantages like:

Compatibility with industry standard package pin out

Elimination of bond wires thus reducing production cost

Reduction of parasitic inductance and resistance

Lowering package thermal resistance

All of them can only achieve limited effectiveness of top side coolingwhen heat-sinks are put in direct contact with the top of the packagedue to the limited amount of top metal exposed through the plasticencapsulation compound. Each of them exhibits a trade off betweenmaximizing the top metal exposed for heat dissipation and maximizing themetal connecting the top side die electrodes to leads. Morespecifically, as the number of top side die electrodes and/or the numberof top side plate features of lower elevation (dimples, anchor holes,plane portions, valley portions, conductive bridges between fingers,windows) increase the available area for exposed top surface of each topside plate for heat dissipation correspondingly decreases causingfurther degradation of effectiveness of top side cooling. Therefore, itremains highly desirable to further enhance the effectiveness of topside cooling while optimizing connection to the semiconductor die andmaintaining a semiconductor device packaging footprint that conforms toan industry standard package pin out.

SUMMARY OF THE INVENTION

A top-side cooled semiconductor package with stacked interconnectionplates is proposed. The semiconductor package includes:

-   -   A circuit substrate having numerous terminal leads for external        electrical connection.    -   At least one semiconductor die whose bottom surface is bonded        atop the circuit substrate.    -   A first number of elevation-adaptive low thermal and electrical        resistance intimate interconnection plates for bonding and        interconnecting a top contact area of the semiconductor die with        the circuit substrate. The intimate interconnection plates are        three dimensionally formed to accommodate for elevation        difference between the top contact area and the circuit        substrate.    -   A second number of low thermal resistance stacked        interconnection plates, each stacked and bonded atop a selected        number of intimate interconnection plates, for adding effective        top-side cooling to the semiconductor package.    -   A molding encapsulant for encapsulating most of the        semiconductor package except for exposing at least a top surface        of at least one stacked interconnection plate through the        molding encapsulant to maintain effective top-side cooling.

As a refinement, the periphery of the top surface of at least onestacked interconnection plate is partially etched. The partially etchedperiphery acts to strengthen the locking of the molding encapsulant tothe top of the semiconductor package.

As another refinement, the top portion of at least one stackedinterconnection plate includes a peripheral overhang above itscorrespondingly bonded intimate interconnection plates. The peripheraloverhang allows for a maximized exposed top surface area for heatdissipation independent of otherwise areal constraints applicable to theselected number of intimate interconnection plates. The periphery of atleast one stacked interconnection plate can be partially etched at itsunderside to create the peripheral overhang. Alternatively, at least onestacked interconnection plate can be three dimensionally formed tocreate the peripheral overhang.

As another refinement, each of the selected number of intimateinterconnection plates can be shaped and sized, independently of theamount of exposed top surface of its corresponding stackedinterconnection plate, to maximize its corresponding bonding areas onthe semiconductor die thus reducing their associated spreadingresistance.

As another refinement, at least one elevation-adaptive intimateinterconnection plate can include numerous locking tabs placed inintermeshing relationship with a corresponding number of terminal leadsnearby to minimize rotational creepage of the semiconductor die during apackaging process for the semiconductor package. Likewise, at least onestacked interconnection plate can include numerous locking tabs placedin intermeshing relationship with a corresponding number of terminalleads nearby to minimize rotational creepage of the semiconductor dieduring packaging as well.

As additional refinements, at least one of the intimate interconnectionplates can include:

-   -   Numerous dimples for contact with the top metalized contact        areas of the semiconductor die.    -   Numerous anchor holes to facilitate solder paste fill while        making contact with the top metalized contact areas of the        semiconductor die.

In one embodiment, the circuit substrate can be made of a leadframe.Alternatively, the circuit substrate can be made of a laminated circuithaving numerous thermal vias to increase bottom-side cooling.

An alternative top-side cooled semiconductor package with stackedinterconnection plates is proposed. The alternative semiconductorpackage includes:

-   -   A circuit substrate having a first plurality of terminal leads        for external electrical connection.    -   A semiconductor die whose bottom surface is bonded atop the        circuit substrate.    -   A first number of elevation-adaptive low thermal and electrical        resistance intimate interconnection plates for bonding a top        contact area of the semiconductor die and forming a second        plurality of terminal leads for external electrical connection        while being three dimensionally formed to accommodate for        elevation difference between.    -   A second number of low thermal resistance stacked        interconnection plates, each stacked and bonded atop a selected        number of intimate interconnection plates, for adding effective        top-side cooling to the semiconductor package.

A method of packaging a top-side cooled semiconductor package of asemiconductor die interconnected with numerous elevation-adaptiveintimate interconnection plates and elevation-adaptive stackedinterconnection plates is proposed. The method includes:

-   a) Providing a circuit substrate having numerous terminal leads for    external electrical connection.-   b) Providing the semiconductor die and attaching it atop the circuit    substrate.-   c) Providing and attaching numerous intimate interconnection plates    to the top contact areas of the semiconductor die and the circuit    substrate for electrical connection between the top contact areas    and the terminal leads.-   d) Providing and attaching numerous stacked interconnection plates    atop a selected number of intimate interconnection plates.-   e) Molding an encapsulant over the package in progress.-   f) Removing a top portion of the molding encapsulant till the top    surfaces of the stacked interconnection plates are exposed to    maintain effective top-side cooling.

As a process variation, the above steps e) and f) can be replaced by:

-   e) Placing a detachable mask over each top surface of the stacked    interconnection plates to be ultimately exposed.-   f) Molding an encapsulant over the package in progress.-   g) Removing the detachable masks from the package in progress to    expose the top surfaces of the stacked interconnection plates to    maintain effective top-side cooling.    More generally speaking, the steps e), f) and g) may be replaced by:-   e) forming a molding encapsulant over the package in progress such    that the top surface of the stacked interconnection plate is exposed    to maintain effective top-side cooling.

As a process refinement, the above step d) further includes:

-   d1) Dispensing a bonding agent atop a selected number of intimate    interconnection plates for connecting the stacked interconnection    plates with the intimate interconnection plates.-   d2) Treating the package in progress to activate the bonding agent    thus forming a permanent bond between the stacked interconnection    plates and the selected intimate interconnection plates.

These aspects of the present invention and their numerous embodimentsare further made apparent, in the remainder of the present description,to those of ordinary skill in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more fully describe numerous embodiments of the presentinvention, reference is made to the accompanying drawings. However,these drawings are not to be considered limitations in the scope of theinvention, but are merely illustrative.

FIG. 1A and FIG. 1B are drawing excerpts from prior art U.S. applicationSer. No. 11/799,467;

FIG. 2 is a drawing excerpt from prior art U.S. Pat. No. 6,249,041;

FIG. 3 is a drawing excerpt from prior art U.S. Pat. No. 4,935,803;

FIG. 4A and FIG. 4B are drawing excerpts from prior art US 20080087992;

FIG. 4C and FIG. 4D are drawing excerpts from prior art U.S. applicationSer. No. 12/130,663;

FIG. 4E and FIG. 4F are drawing excerpts from prior art U.S. applicationSer. No. 12/237,953;

FIG. 5A and FIG. 5B illustrate an embodiment of the present inventionsemiconductor package with an intimate interconnection plate and astacked interconnection plate having a half etched peripheral overhang;

FIG. 6 illustrates an embodiment of the present invention wherein thestacked interconnection plate is formed to create a peripheral overhang;

FIG. 7 illustrates an embodiment of the present invention wherein aperipheral end of the intimate interconnection plate is made into aplurality of terminal leads;

FIG. 8A to FIG. 8C illustrate an embodiment of the present inventionwherein the intimate interconnection plate features dimples and ananchor hole while the stacked interconnection plate features aperipheral overhang and locking tabs; and

FIG. 9A and FIG. 9B illustrate an embodiment of the present inventionwherein the stacked interconnection plate includes locking tabs and theperiphery of the top surface of the stacked interconnection plate ispartially etched to strengthen the locking of the molding encapsulant tothe semiconductor package.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

The description above and below plus the drawings contained hereinmerely focus on one or more currently preferred embodiments of thepresent invention and also describe some exemplary optional featuresand/or alternative embodiments. The description and drawings arepresented for the purpose of illustration and, as such, are notlimitations of the present invention. Thus, those of ordinary skill inthe art would readily recognize variations, modifications, andalternatives. Such variations, modifications and alternatives should beunderstood to be also within the scope of the present invention.

FIG. 5A and FIG. 5B illustrate a top-side cooled semiconductor package500 having an intimate interconnection plate 526 and a stackedinterconnection plate 528. FIG. 5B is a cross sectional view of FIG. 5Aalong a direction A-A. The top-side cooled semiconductor package 500includes:

-   -   A circuit substrate that is, in this illustrated example, a        leadframe 502 having numerous terminal leads 506 for making        external electrical connection.    -   A semiconductor die 520 whose die bottom surface 520 b is bonded        atop a die pad 504 of the leadframe 502.    -   An elevation-adaptive low thermal resistance intimate        interconnection plate 526 for bonding and interconnecting a top        contact area of a die top surface 520 a with the leadframe 502.        The intimate interconnection plate 526 is three dimensionally        formed to accommodate for elevation difference between the top        contact area and the leadframe 502 thus making an electrical        connection between the top contact area and the terminal leads        506. As illustrated, the intimate interconnection plate 526 may        also have dimples 526 a for reducing related bonding stress and        improving related bonding agent flow.    -   A low thermal resistance stacked interconnection plate 528,        stacked and bonded atop the intimate interconnection plate 526,        for adding effective top-side cooling to the semiconductor        package 500. The stacking of the flat topped stacked        interconnection plate 528 atop the intimate interconnection        plate 526 helps to improve manufacturability through reduced        sensitivity to tilt, rotation and warpage of the intimate        interconnection plate below that could otherwise cause bonding        reliability problem between the intimate interconnection plate        526 and top contact areas of the die top surface 520 a. Notably,        the stacked interconnection plate 528 also has an underside        partially etched peripheral overhang 528 b that is located above        the intimate interconnection plate 526 and additional        interconnection plate 524 which can be a gate clip.        Alternatively, the gate clip can be replaced with a gate bonding        wire. The stacked interconnection plate 528 does not contact the        additional interconnection plate 524 due to the peripheral        overhang 528 b. This allows for a maximized exposed top surface        528 a area for heat dissipation independent of otherwise areal        constraints applicable to the intimate interconnection plate 526        and other interconnection plate 524 below. In other words, the        aforementioned trade off, of cited prior arts, between amount of        top metal exposed for heat dissipation and amount of metal        contacting the top side die electrodes can be substantially        reduced. More specifically under the present invention, as the        number of top side die electrodes and/or the number of top side        plate features of lower elevation (dimples, anchor holes, plane        portions, valley portions, conductive bridges between fingers,        windows) increase the available effective exposed top surface        area for heat dissipation thus top side cooling will now only        decrease by a much lesser degree compared to the cited prior        arts. By the same token, the intimate interconnection plates 526        can be shaped and sized, independently of the amount of exposed        top surface 528 a of the stacked interconnection plate 528        above, to maximize its corresponding bonding areas on the        semiconductor die 520 thus reducing its associated spreading        resistance. To those skilled in the art, when the intimate        interconnection plate 526 and the stacked interconnection plate        528 are also made of high electrical conductivity material such        as metal the top-side cooled semiconductor package 500 of the        present invention can offer minimized die-to-terminal leads        electrical resistance and die-to-ambient thermal resistance at        the same time in the presence of increased number of top side        die electrodes and plate features of lower elevation.    -   A molding encapsulant 530 for encapsulating most of the        semiconductor package 500 except for exposing a top surface 528        a of the stacked interconnection plate 528 through the molding        encapsulant 530 to maintain effective top-side cooling. As the        stacked interconnection plate 528 with peripheral overhang 528 b        substantially increases the total contact adhesion area of the        molding encapsulant 530, it offers the benefit of improved        molding encapsulant adhesion against delamination and increased        package moisture resistance against ambient humidity.

FIG. 6 illustrates an embodiment of the present invention wherein astacked interconnection plate 628 of a top-side cooled semiconductorpackage 600 is mechanically formed three dimensionally (rather thanpartially etched) to create a peripheral overhang 628 b. In this case,an intimate interconnection plate 626 (with dimples 626 a) and a stackedinterconnection plate 628 successively contact the die top surface 620 aof a semiconductor die 620. The bottom surface 620 b of thesemiconductor die 620 sits atop a die pad 604 of a leadframe 602. Topsurfaces 628 a of the stacked interconnection plate 628 and numerousterminal leads 606 are exposed through a molding encapsulant 630.Comparing with the partially etched peripheral overhang 528 b, while themechanically formed peripheral overhang 628 b can be easier to make, itnevertheless results in a reduced exposed top surface 628 a area forheat dissipation.

FIG. 7 illustrates an embodiment of the present invention wherein astacked interconnection plate 728 of a top-side cooled semiconductorpackage 700 is mechanically formed and, as a design variation, aperipheral end of an intimate interconnection plate 726 is formed intonumerous terminal leads 706 a for external electrical connection. Here,an intimate interconnection plate 726 (with dimples 726 a) and a stackedinterconnection plate 728 successively contact the die top surface 720 aof a semiconductor die 720. The bottom surface 720 b of thesemiconductor die 720 sits atop a die pad 704 of a leadframe 702. Topsurfaces 728 a of the stacked interconnection plate 728 and numerousterminal leads 706 are exposed through a molding encapsulant 730.Similarly, although not illustrated here, a peripheral end of a stackedinterconnection plate can be formed into terminal leads for externalelectrical connection as well.

FIG. 8A to FIG. 8C are perspective illustration of a present inventionsemiconductor package 900 wherein the intimate interconnection plate 926features dimples 926 a and an anchor hole 926 b while the stackedinterconnection plate 928 features a peripheral overhang 928 b andlocking tabs 928 e and 928 f. The anchor hole 926 b functions tofacilitate solder paste fill for the intimate interconnection plate 926while making contact with top metalized contact areas of thesemiconductor die 920. There may be an additional interconnection plate924 with a dimple 924 a, e.g. a gate clip, to connect anothersemiconductor region on the semiconductor die 920 to lead 906 h Theanchor hole 926 b functions to help anchor the intimate interconnectionplate 926 in place when the molding compound is added and for stressrelief. Notably, the locking tabs 928 e and 928 f are sized and locatedon the stacked interconnection plate 928 such that, upon bonding of thestacked interconnection plate 928 onto the intimate interconnectionplate 926, they are placed in intermeshing relationship with acorresponding number of terminal leads 906 e, 906 f and 906 g nearby tominimize rotational creepage of the semiconductor die 920 and theintimate interconnection plate 926 during a packaging process for thetop-side cooled semiconductor package 900. As to their construction, thelocking tabs 928 e and 928 f can be created on the stackedinterconnection plate 928 with mechanical punching and forming of astarting blank plate. To those skilled in the art, the locking tabs canalternatively be created on the intimate interconnection plate 926 toserve a similar purpose as well. As shown in FIG. 8B, the stackedinterconnection plate 928 may also have top dimples 928 a for locking inplace with the dimples 926 a of the intimate interconnection plate 926.FIG. 8C illustrates the completed top-side cooled semiconductor package900 with a molding encapsulant 930, an exposed top surface of thestacked interconnection plate 928 with top dimples 928 a and exposedterminal leads 906 e, 906 f, 906 g and 906 h.

FIG. 9A and FIG. 9B are perspective illustration of a present inventionsemiconductor package 1000 wherein the stacked interconnection plate1028 includes locking tabs 1028 e, 1028 f intermeshing with terminalleads 1006 e, 1006 f and 1006 g of the leadframe 1002. While not shownhere to avoid obscuring details, additional locking tabs can be createdon the intimate interconnection plate 1026 to intermesh with terminalleads 1006 e, 1006 f, and 1006 g of the leadframe 1002 as well. Theintimate interconnection plate electrically connects the top of thesemiconductor die 1020 to the terminal leads 1006 e, 1006 f, and 1006 g.Notice that the periphery of the top surface of the stackedinterconnection plate 1028 is partially etched to create numerouspartially etched ledges 1028 k. These partially etched ledges 1028 kfunction to strengthen the locking of a molding encapsulant 1030 to thesemiconductor package 1000. An additional interconnection plate 1024 mayconnect to terminal lead 1006. By way of example the additionalinterconnection plate 1024 may be a gate clip for connecting a gateregion on the semiconductor die to a gate lead. FIG. 9B illustrates thecompleted top-side cooled semiconductor package 1000 with the moldingencapsulant 1030, an exposed top surface of the stacked interconnectionplate 1028 for heat dissipation and exposed terminal leads 1006 (FIG.9A), 1006 e, 1006 f, 1006 g and 1006 h for external electricalconnection.

By now it should become clear to those skilled in the art that, withinthe context of the present invention, the circuit substrate, instead ofbeing a leadframe, can be a laminated circuit having numerous terminalleads for making external electrical connection. However, to insureeffective bottom-side heat dissipation, the laminated circuit shouldinclude a plurality of thermal vias. To minimize die-to-terminal leadselectrical resistance and die-to-ambient thermal resistance, theintimate interconnection plate should be made of thermally andelectrically conductive material. The stacked interconnection plateshould be made of thermally conductive or thermally and electricallyconductive material. Also, the top-side cooled semiconductor packagealso expects to work for a normal (substrate down) or flip chip(substrate up) die orientation atop the circuit substrate. Additionally,whether the circuit substrate is made of a leadframe or a laminatedcircuit, the numerous features of the present invention semiconductorpackage as described above can all be embodied in a correspondingpackage pin out geometry that is compatible with an industry standardpackage pin out such as Small Outline Integrated Circuit (SOIC), DualFlat No-lead (DFN), Quad Flat No-lead (QFN), Micro Leadless Package(MLP) or Transistor Outline (TO) series).

With reference made to FIG. 5A and FIG. 5B as an illustrative example, amethod of packaging the top-side cooled semiconductor package 500includes:

-   -   a) Provide a leadframe 502 with terminal leads 506 for external        connection. To implement a package pin out geometry that is        compatible with an industry standard, for example, an industry        standard pin out lead frame should be used here. A bonding agent        is then dispensed atop the leadframe die pad 504 and terminal        leads 506. The bonding agent can be made of a solder paste, a        thermal and/or electrically conductive epoxy, etc. and it can be        thermally or UV (ultra violet) cured.    -   b) Provide a semiconductor die 520 and attach it atop the        leadframe 502. More specifically, the semiconductor die 520 can        be attached to the leadframe 502 via solder attach as in a        standard die attachment procedure. Solderable top metal should        be used on the semiconductor die 520. For example, exposed        Aluminum in the source and gate pad regions of a MOSFET die        should be electrolessly plated with NiAu.    -   c) Provide and attach an intimate interconnection plate 526 to        the top contact areas of the semiconductor die 520 and the        leadframe 502 for electrical connection between the top contact        areas and the terminal leads 506. More specifically, the        intimate interconnection plate 526 can be attached to the        semiconductor die 520 via solder die attach. A bonding agent is        then dispensed atop the intimate interconnection plate 526.    -   d) Provide and attach a stacked interconnection plate 528 atop        the intimate interconnection plate 526. More specifically, the        stacked interconnection plate 528 can be attached to the        intimate interconnection plate 526 via solder attach. As an        alternative, an electrically and thermally conductive epoxy can        be used to attach the stacked interconnection plate 528 to the        intimate interconnection plate 526. The package in progress is        then treated to activate the various bonding agents thus forming        a permanent bond between the stacked interconnection plate 528        and the intimate interconnection plate 526. The package        treatment can involve using heat, UV, etc. to reflow a solder        paste or to cure an epoxy.    -   e) Forming a molding encapsulant 530 over the package in        progress such that the top surface 528 a of the stacked        interconnection plate 528 is exposed to maintain effective        top-side cooling.

By way of example, step e) may be carried out by:

-   -   e1) Mold a molding encapsulant 530 over the package in progress.    -   e2) Remove a top portion of the molding encapsulant 530 till the        top surface 528 a of the stacked interconnection plate 528 is        exposed to maintain effective top-side cooling. More        specifically, mechanical grinding can be employed for the        removal.

Subsequent additional miscellaneous package finishing steps like leadfinishing by plating, package marking and lead trimming are not detailedhere. As a process variation, the above steps e1) and e2) can bereplaced by:

-   -   e1) Place a detachable mask (not shown here) over the top        surface 528 a of the stacked interconnection plate 528 to be        ultimately exposed.    -   e2) Mold a molding encapsulant 530 over the package in progress.    -   e3) Remove the detachable mask from the package in progress to        expose the top surface 528 a of the stacked interconnection        plate 528 to maintain effective top-side cooling.

A top-side cooled semiconductor package with an intimate interconnectionplate and a stacked interconnection plate has been described forminimizing die-to-terminal electrical resistance and die-to-ambientthermal resistance at the same time in the presence of multiple top sidedie electrodes and plate features of lower elevation. By now it shouldbecome clear to those skilled in the art that the numerous embodimentsjust described can be readily modified to suit other specificapplications as well. While the description above contains manyspecificities, these specificities should not be constructed asaccordingly limiting the scope of the present invention but as merelyproviding illustrations of numerous presently preferred embodiments ofthis invention. For example, the present invention semiconductor packagesystem expects to be applicable to the co-packaging of multiplesemiconductor dies such as a high-side FET die and a low-side FET diefor use in a power converter circuit. For another example, the presentinvention expects to be applicable to the packaging of a wide variety ofsemiconductor dies other than just MOSFET dies as disclosed herein.These semiconductor dies include IGBT and dies made of SiGe, SiC, GaAsand GaN. For another example, the same inventive concept of the presentinvention can be extended to employ multiple intimate interconnectionplates and multiple stacked interconnection plates. For yet anotherexample, the present invention can be extended to employ multiple layersof stacked interconnection plate as well.

Throughout the description and drawings, numerous exemplary embodimentswere given with reference to specific configurations. It will beappreciated by those of ordinary skill in the art that the presentinvention can be embodied in numerous other specific forms and those ofordinary skill in the art would be able to practice such otherembodiments without undue experimentation. The scope of the presentinvention, for the purpose of the present patent document, is hence notlimited merely to the specific exemplary embodiments of the foregoingdescription, but rather is indicated by the following claims. Any andall modifications that come within the meaning and range of equivalentswithin the claims are intended to be considered as being embraced withinthe spirit and scope of the present invention.

What is claimed are:
 1. A top-side cooled semiconductor package withstacked interconnection plates comprising: a circuit substrate having afirst plurality of terminal leads for external electrical connection; atleast one semiconductor die whose bottom surface is bonded atop thecircuit substrate; a first number of elevation-adaptive low thermal andelectrical resistance intimate interconnection plates for bonding a topcontact area of said at least one semiconductor die and forming a secondplurality of terminal leads for external electrical connection whilebeing three dimensionally formed to accommodate for elevation differencethere between; and a second number of low thermal resistance stackedinterconnection plates, each stacked and bonded atop a selected numberof intimate interconnection plates, for adding effective top-sidecooling to the semiconductor package.
 2. The top-side cooledsemiconductor package of claim 1 further comprising a moldingencapsulant for encapsulating most of the semiconductor package whereinat least a top surface of at least one stacked interconnection plate isexposed through the molding encapsulant to maintain effective top-sidecooling.
 3. The top-side cooled semiconductor package of claim 2 whereinsaid at least one semiconductor die further comprise a high-side FET dieand a low-side FET die for a power converter circuit.
 4. A top-sidecooled semiconductor package with stacked interconnection platescomprising: a circuit substrate having a plurality of terminal leads forexternal electrical connection; at least one semiconductor die whosebottom surface is bonded atop the circuit substrate; a first number ofelevation-adaptive low thermal and electrical resistance intimateinterconnection plates for bonding and interconnecting a top contactarea of said at least one semiconductor die with said circuit substratewhile being three dimensionally formed to accommodate for elevationdifference there between whereby electrically connecting said topcontact area with ones of said terminal leads; a second number of lowthermal resistance stacked interconnection plates, each stacked andbonded atop a selected number of intimate interconnection plates, foradding effective top-side cooling to the semiconductor package; andwherein the circuit substrate is a laminated circuit further comprisinga plurality of thermal vias to increase bottom-side cooling.
 5. A methodof packaging a top-side cooled semiconductor package of a semiconductordie interconnected with a plurality of elevation-adaptive intimateinterconnection plates and elevation-adaptive stacked interconnectionplates, the method comprises: a) providing a circuit substrate having aplurality of terminal leads for external electrical connection; b)providing the semiconductor die and attaching it atop the circuitsubstrate; c) providing and attaching the plurality of intimateinterconnection plates to the top contact areas of said semiconductordie and said circuit substrate for electrical connection between saidtop contact areas and said terminal leads; and d) providing andattaching the plurality of stacked interconnection plates atop theselected number of intimate interconnection plates.
 6. The method ofclaim 5 further comprising: e) forming a molding encapsulant over thepackage in progress such that the top surface of the stackedinterconnection plate is exposed to maintain effective top-side cooling.7. The method of claim 6 wherein step e) further comprises: e1) moldingan encapsulant over the package in progress; and e2) removing a topportion of the molding encapsulant till the top surfaces of the stackedinterconnection plates are exposed to maintain effective top-sidecooling.
 8. The method of claim 6 wherein step e) further comprises: e1)placing a detachable mask over each top surface of the stackedinterconnection plates to be ultimately exposed; e2) molding anencapsulant over the package in progress; and e3) removing thedetachable masks from the package in progress to expose the top surfacesof the stacked interconnection plates to maintain effective top-sidecooling.
 9. The method of claim 5 wherein said circuit substrate is aleadframe and providing the circuit substrate further comprisesdispensing a bonding agent atop the leadframe die pads and leadframeleads.
 10. The method of claim 5 wherein providing and attaching theplurality of stacked interconnection plates further comprising: d1)dispensing a bonding agent atop a selected number of said plurality ofintimate interconnection plates for connecting the stackedinterconnection plates with the intimate interconnection plates; and d2)treating the package in progress to activate the bonding agent thusforming a permanent bond between the stacked interconnection plates andthe selected intimate interconnection plates.